Document Type and Number:
Japanese Patent JPS5083756
Kind Code:
A
Abstract:
An electronic circuit microelement, seated on the upper surface of a circuit board or chassis, has its terminals projecting upwardly away from said upper surface to a level well above its body. Elongated connectors, one for each terminal, have medial parts anchored in the circuit board, pin-like lower parts projecting beneath the lower surface of the circuit board, and upper parts formed as upstanding S-shaped grooved spring arms that engage the microelement terminals in a plane spaced above the microelement body so that the connectors can be soldered to the terminals by immersion.
Application Number:
JP9844374A
Publication Date:
July 07, 1975
Filing Date:
August 29, 1974
Export Citation:
International Classes:
H01L23/32; H01L25/10; H01R24/00; H01L25/18; H01R33/74; H05K1/18; H05K3/34; H05K7/10; (IPC1-7): H01L23/00; H05K3/30
Foreign References:
| US3701075A | 1972-10-24 |