Document Type and Number:
Japanese Patent JPS5220507
Kind Code:
B2
Abstract:
Multiple ply structural panels, such as veneer-overlayed particleboard panels, are manufactured by bonding together the component materials under conditions of elevated pressure and temperature using a binder system comprising an organic polyisocyanate and formaldehyde. Through the use of this novel binder system, structural panels may be produced incorporating quantities of tree-derived materials such as bark and evergreen needles, previously considered unusable. Moreover, the physical properties and moisture resistance of the resultant products are competitive with those of conventional wood-based structural panels.
Application Number:
JP1736475A
Publication Date:
June 03, 1977
Filing Date:
February 10, 1975
Export Citation:
International Classes:
B32B23/02; B27N3/02; C08G18/00; C08G18/08; C08L97/02