Title:
【発明の名称】半導体集積回路用セラミツクパツケ-ジの製造法
Document Type and Number:
Japanese Patent JPS5814743
Kind Code:
B2
Inventors:
SUZUKI TAKESHI
Application Number:
JP306077A
Publication Date:
March 22, 1983
Filing Date:
January 14, 1977
Export Citation:
Assignee:
NGK INSULATORS LTD
International Classes:
H01L23/12; H01L21/52; H01L23/08; H01L23/48; (IPC1-7): H01L23/12
Attorney, Agent or Firm:
Akihide Sugimura