Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PREPARATION OF SOFT COPPER WIRE
Document Type and Number:
Japanese Patent JPS58181853
Kind Code:
A
Abstract:

PURPOSE: To prepare a soft copper wire material with low softening point, possibility of continuous annealing and high industrial productivity, by subjecting tough pitch copper having a specific amount of lead added thereto to heat treatment under a proper condition.

CONSTITUTION: Lead alone or impurities comprising a combination of lead, tin and nickel is added to tough pitch copper so as to adjust lead content to 10W 800ppm and the lead fortified copper is melted, cast and further hot rolled to obtain the copper material for wire. This copper material is subsequently subjected to heat treatment at 500W700°C for one min or more to obtain a soft copper material with a low softening temp. This copper material is drawn to be able to be formed into a drawn copper wire. In addition, the copper material after the addition of the above mentioned lead can be subjected to heat treatment in a form of a plate material or a strand material and the lowering of the softening temp. is not generated when the addition amount of lead and the temp. of heat treatment are out of the above mentioned limited range.


Inventors:
MIYAKE YASUHIKO
AOYAMA MASAYOSHI
YONEMOTO TAKAHARU
OONUKI MITSUAKI
Application Number:
JP19711681A
Publication Date:
October 24, 1983
Filing Date:
December 08, 1981
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI CABLE
International Classes:
B21C1/00; B21C9/00; C22F1/08; (IPC1-7): B21C1/00; B21C9/00; C22F1/08
Attorney, Agent or Firm:
Fujio Sato