Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JPS5923106
Kind Code:
B2
Inventors:
YAMAZAKI KENZO
Application Number:
JP12264776A
Publication Date:
May 30, 1984
Filing Date:
October 13, 1976
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L23/52; H01L21/28; H01L21/308; H01L21/3205; H01L21/60; (IPC1-7): H01L21/60; H01L21/306
Attorney, Agent or Firm:
Uchihara Shin