Title:
感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、積層体の製造方法および半導体デバイス
Document Type and Number:
Japanese Patent JPWO2018025738
Kind Code:
A1
Abstract:
低温でも高い閉環率で閉環が可能な感光性樹脂組成物であって、上記感光性樹脂組成物を硬化して得られる硬化膜のガラス転移温度が高い感光性樹脂組成物、ならびに、上記感光性樹脂組成物を用いた、硬化膜、積層体、硬化膜の製造方法、積層体の製造方法および半導体デバイスの提供。複素環含有ポリマー前駆体と、熱塩基発生剤と、第４族元素を含む有機化合物を含む感光性樹脂組成物。
Inventors:
Yu Iwai
Van Closter Stefan
Jansen Dmitri
Bart casper
Van Closter Stefan
Jansen Dmitri
Bart casper
Application Number:
JP2018531857A
Publication Date:
May 30, 2019
Filing Date:
July 27, 2017
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
G03F7/004; C08G73/10; C08G73/22; G03F7/027; G03F7/037; G03F7/20; H01L21/027
Domestic Patent References:
| JP2004091572A | 2004-03-25 | |||
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| JPS60121740A | 1985-06-29 | |||
| JP2016027357A | 2016-02-18 | |||
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| JP2011191749A | 2011-09-29 | |||
| JP2000112124A | 2000-04-21 | |||
| JP2001516074A | 2001-09-25 |
Foreign References:
| WO2015199219A1 | 2015-12-30 |
Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes
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