Document Type and Number:
Japanese Patent JPWO2021171823
Kind Code:
A1
Abstract:
An object of the present technology is to prevent damage in a bonded portion between a semiconductor chip and a substrate in a semiconductor device in which the semiconductor chip is mounted on the substrate.A terminal is disposed between an electrode of an element and an electrode of a substrate on which the element is mounted, and electrically connects the electrode of the element and the electrode of the substrate. The terminal includes a plurality of unit lattices and a coupling portion. The unit lattices included in the terminal are formed by bonding a plurality of beams in a cube shape. The coupling portion included in the terminal couples adjacent unit lattices among the plurality of unit lattices.
Application Number:
JP2022503146A
Publication Date:
September 02, 2021
Filing Date:
January 15, 2021
Export Citation:
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