Document Type and Number:
Japanese Patent JPWO2022045124
Kind Code:
A1
Abstract:
Provided are: a curable resin composition in which the total content of a cyclic imide structure and a cyclic isoimide structure of a polyimide precursor is 0.01-1.0 mmol/g, and the content of an amic acid ester structure is 97-100% (exclusive of 97) with respect to the total mol of an amic acid structure and the amic acid ester structure in the polyimide precursor; a cured product formed by curing the curable resin composition; a laminate containing the cured product; a method for producing the cured product; and a semiconductor device including the cured product or the laminate.
Application Number:
JP2022544619A
Publication Date:
March 03, 2022
Filing Date:
August 24, 2021
Export Citation:
