Document Type and Number:
Japanese Patent JPWO2022054146
Kind Code:
A1
Abstract:
An application device according to an embodiment includes a liquid nozzle part, an air nozzle part, and an ejection controlling unit. The liquid nozzle part ejects liquid to be applied to an electronic component mounted on a substrate. The air nozzle part ejects air toward the substrate. The air nozzle is concentrically arranged with respect to the liquid nozzle part. The ejection controlling unit ejects the air from the air nozzle part at a timing in synchronization with an ejection timing of the liquid to be applied by the liquid nozzle part.
Application Number:
JP2021557851A
Publication Date:
March 17, 2022
Filing Date:
September 08, 2020
Export Citation:
Domestic Patent References:
| JP2010087198A | 2010-04-15 |