Document Type and Number:
Japanese Patent JPWO2022080215
Kind Code:
A1
Abstract:
A machine-learning device performs machine-learning under machining conditions including at least a waiting time of laser emission for controlling machining of a subject to be machined in a laser machining apparatus, and comprises: an action output unit which selects, as an action, a machining condition from a plurality of machining conditions, and outputs the action to the laser machining apparatus; a state acquisition unit which acquires, as state information, image data obtained by imaging a machined state of the subject that has been machined by the action; a reward calculation unit which calculates a reward on the basis of the waiting time of the laser emission and the machining accuracy of the machining state calculated on the basis of at least the acquired state information; and a learning unit which performs machine-learning on the machining conditions on the basis of the acquired state information and the calculated reward.
Application Number:
JP2022557413A
Publication Date:
April 21, 2022
Filing Date:
October 06, 2021
Export Citation:
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