Document Type and Number:
Japanese Patent JPWO2022163537
Kind Code:
A1
Abstract:
A glue supply apparatus for a gypsum board supplies glue to a board base paper of the gypsum board. The glue supply apparatus includes a tank section configured to store the glue; a supply port disposed near an end of the board base paper of the gypsum board and configured to supply the glue; and a pump section disposed on a glue supply path between the tank section and the supply port. The pump section is a positive displacement pump.
Application Number:
JP2022578335A
Publication Date:
August 04, 2022
Filing Date:
January 21, 2022
Export Citation:
