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Title:
3次元形状測定方法
Document Type and Number:
Japanese Patent JP5733923
Kind Code:
B2
Abstract:
A method of measuring a 3D shape, which can measure a 3D shape of target objects on a board by searching a database for bare board information when a measuring object is not set to a normal inspection mode or by performing bare board teaching when the board is supplied from a supplier having not the bare board information is provided. The method of measuring a 3D shape includes operation S100 of measuring a brightness of a first illumination source 41a, operation S200 of measuring a phase-to-height conversion factor, operation S300 of determining whether the measurement is performed in a normal inspection mode, operation S400 of measuring a 3D shape of a board 62 according to the normal inspection mode, operation S500 of determining whether bare board information about the board 62 is included, operation S600 of performing bare board teaching when the bare board information is excluded, operation S700 of measuring the 3D shape of target objects on the board 62 when the bare board information is included or bare board teaching information is generated, and operation S800 of analyzing whether the board 62 is normal or abnormal by using 3D shape information. Therefore, the 3D shape of target objects on the board may be more readily measured.

Inventors:
Min Yun Kim
Hye Tae Kim
Byun Min Yoo
Se Hyun Han
Sun Jun Lee
Application Number:
JP2010165322A
Publication Date:
June 10, 2015
Filing Date:
July 22, 2010
Export Citation:
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Assignee:
Co Young Technology Incorporated
International Classes:
G01B11/25; G06T1/00
Domestic Patent References:
JP2002286427A
JP2005233780A
JP11241916A
JP2005207918A
JP2004309240A
JP2005337943A
JP6011321A
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto