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Title:
ABRASIVE GRAIN BURYING DEVICE AND METHOD, AND POLISHING DEVICE USING IT
Document Type and Number:
Japanese Patent JP2003311605
Kind Code:
A
Abstract:

To bury and fix abrasive grains into a surface plate at a high density in a short time.

The surface plate 1 is rotated by a motor (not shown), and working fluid 7 containing abrasive grains is dripped onto a metal layer 2 disposed on the surface plate 1, thereby forming a liquid layer of free abrasive grains. A movable member 4 is faced to a surface of the metal layer 2 and is stored in a fixing member 3, and is repeatedly moved vertically by the motor 6 with respect to the surface of the metal layer 2 as shown in the arrow A-B direction. When the movable member 4 moves in the arrow direction to increase the interval between the movable member 4 and the metal layer 2, a liquid layer having uniformly dispersed free abrasive grains intrudes into the gap between them. When the movable member 4 moves in the arrow B direction to be pressed to the metal layer 2, the interval becomes narrow, and the surface of the movable member 4 causes the free abrasive grains to be buried into the metal layer 2, and the free abrasive grains are fixed. By the vertical movement of the movable member 4, uniform fixed abrasive grains can be obtained at a high density in a short time.


Inventors:
HOTTA HIDEJI
TAMURA TOSHIO
FURUSAWA KENJI
Application Number:
JP2002118158A
Publication Date:
November 05, 2003
Filing Date:
April 19, 2002
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
B24B37/00; B24B37/12; G11B5/187; (IPC1-7): B24B37/00; B24B37/04; G11B5/187
Attorney, Agent or Firm:
Ichiro Suzuki (1 person outside)



 
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