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Patent Searching and Data


Title:
ABRASIVE GRAIN FIXED WIRE, WORK MACHINING DEVICE USING IT, AND COATING COMPOSITION FOR ABRASIVE GRAIN FIXED WIRE
Document Type and Number:
Japanese Patent JP2000301446
Kind Code:
A
Abstract:

To reduce wire diameter and cuff loss of a workpiece by forming a layer containing abrasive grains and resin on a wire by electrocoating.

In an abrasive grain fixed wire 1, abrasive grains and resin as a binding agent are formed on a wire rod by electrocoating. Consequently, the wire rod must form positive electrode or negative electrode by the charge of used resin, but for a wire rod of insulating property and unable to form electrode, by plating metallic material on the surface by electroless plating or the like, electrocoating can be made. The wire 1 is wound from one reel bobbin 8 onto the other reel bobbin 9 through a guide roller 5, dancer rollers 6, 7, and working rollers 2, 3, 4. A work W is elevatably moved by a field unit, contacted with the wire 1 running between the lower working rollers 2, 3, and by being pressed, it is cut off into wafers.


Inventors:
OKUYAMA TETSUO
FUKUDA KOJI
Application Number:
JP11141599A
Publication Date:
October 31, 2000
Filing Date:
April 19, 1999
Export Citation:
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Assignee:
NIPPEI TOYAMA CORP
International Classes:
B24B27/06; B28D5/04; (IPC1-7): B24B27/06; B28D5/04
Attorney, Agent or Firm:
Takashima Hajime