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Patent Searching and Data


Title:
ABRASIVE GRAIN FLOW POLISHING MACHINE
Document Type and Number:
Japanese Patent JPS6384870
Kind Code:
A
Abstract:

PURPOSE: To promptly further surely polish a fine hole, by dispersedly holding abrasive grains in fluidized media passing through the through hole of a workpiece and applying an ultrasonic vibration to the media so that the media decrease the viscosity improving the fluidity.

CONSTITUTION: Abrasive grains 4 of diamond or the like, for instance, of about #1000 and media 5, for instance, of silicone rubber or the like, having fluidity and dispersedly holding said abrasive grains, are allowed to pass through a fine hole 1 from its one opening of a workpiece 2, held to a holding part 3, and an ultrasonic vibration is applied to the holding part 3 from an ultrasonic wave applying part 7. Consequently, a device uniformly disperses the abrasive grains 4 in the media 5 while softens a binding material, for instance, silicone rubber by generating heat. As a result, the media 5 remarkably improve the fluidity by substantially decreasing the viscosity resistance. Accordingly, the device, which allows the media 5 to smoothly pass through in the fine hole 1 generating no blocking, enables the fine hole 1 to be high accurately further high efficiently polished.


Inventors:
NAKADA JUNJI
Application Number:
JP22966186A
Publication Date:
April 15, 1988
Filing Date:
September 30, 1986
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
B24B31/00; (IPC1-7): B24B31/00
Attorney, Agent or Firm:
Noriyuki Noriyuki