Title:
研磨パッド
Document Type and Number:
Japanese Patent JP7000032
Kind Code:
B2
Abstract:
To provide a polishing pad that has improved wear resistance, prevents a decrease in polishing rate, and can continuously polish a polishing object at a stable polishing rate.SOLUTION: A polishing pad has a polyurethane foam sheet that includes a plurality of tear-shaped bubbles formed by wet deposition as a polishing layer. The polishing layer has fine fibers of 0.1-10 mass% relative to the total mass of the polyurethane foam sheet.SELECTED DRAWING: Figure 1
Inventors:
Suzuki Motofumi
Tatsuma Matsuoka
Tatsuma Matsuoka
Application Number:
JP2017069359A
Publication Date:
January 19, 2022
Filing Date:
March 30, 2017
Export Citation:
Assignee:
Fujibo Holdings Co., Ltd.
International Classes:
B24B37/24; C08J5/04; H01L21/304
Domestic Patent References:
| JP2010058193A | ||||
| JP2010058231A | ||||
| JP2013194163A | ||||
| JP2002001648A | ||||
| JP2014128839A |
Attorney, Agent or Firm:
Shuji Shiokawa