To sufficiently effectively utilize a cooling liquid to be supplied in cooling a abrasive wheel and a material to be ground (semiconductor wafer 38) by improving the abrasive wheel 2.

A cooling liquid reservoir 14 opened inward in the radial direction is formed at inner periphery of a base 4, and a cooling liquid guide groove 62 extending from the cooling liquid reservoir up to a abrasive means 6 is formed on an inner peripheral face and a lower face of the base to prevent the outward flow of the cooling liquid supplied to the base of the abrasive wheel in the radial direction by the cooling liquid reservoir once and then allow the flow of the cooling liquid toward the abrasive means 6 and the material to be ground by mainly passing through the cooling liquid guide groove.