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Patent Searching and Data


Title:
Absorption heat pump device
Document Type and Number:
Japanese Patent JP6361454
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an absorption heat pump apparatus capable of sufficiently coating absorbent onto an absorption member and sufficiently absorb refrigerant steam by the absorbent even when the absorbent is high in viscosity.SOLUTION: In this absorption heat pump apparatus, an absorber 40 comprises a container 41 which includes an upper storage part 41a and a lower storage part 41b storing therein absorbent; and a plate absorption member 42 onto which the absorbent is coated by moving the absorbent in the upper storage part 41a and the lower storage part 41b so as to absorb refrigerant steam.SELECTED DRAWING: Figure 2

Inventors:
Osamu Tsubouchi
Application Number:
JP2014212440A
Publication Date:
July 25, 2018
Filing Date:
October 17, 2014
Export Citation:
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Assignee:
Aisin Seiki Co., Ltd.
International Classes:
F25B15/00
Domestic Patent References:
JP2014142103A
JP2008128560A
JP5780153A
JP2004340078A
JP10267458A
JP201485065A
Foreign References:
WO2011158432A1
US6253571
Attorney, Agent or Firm:
Hirokazu Miyazono