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Title:
ADDITION CURABLE SILICONE ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2012117059
Kind Code:
A
Abstract:

To provide an addition curable silicone adhesive composition which does not require a heat curing furnace, and expresses excellent adhesion to resins and metals in a short period under room temperature conditions.

This addition curable silicone adhesive composition has blended therein an organic compound or an organosilicon compound having at least one (meth)acryl group in one molecule, an organohydrogenpolysiloxane having at least one monovalent aromatic group such as phenyl group, and an organosilicon compound having at least one hydrogen atom bonded to the silicon atom and at least one divalent to tetravalent aromatic group such as phenylene skeleton in one molecule.


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Inventors:
YAMAKAWA NAOKI
YOKOSUKA YUTA
AKEDA TAKASHI
Application Number:
JP2011245033A
Publication Date:
June 21, 2012
Filing Date:
November 09, 2011
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO
International Classes:
C09J183/07; C09J11/04; C09J11/06; C09J183/05; C09J183/06
Domestic Patent References:
JPH0853661A1996-02-27
JP2007009189A2007-01-18
JPH11335564A1999-12-07
JP2000265067A2000-09-26
JP2008156545A2008-07-10
JP2010215719A2010-09-30
JP2002020718A2002-01-23
JP2009185129A2009-08-20
JP2010196011A2010-09-09
JP2009185129A2009-08-20
JP2010196011A2010-09-09
JPH0853661A1996-02-27
JP2007009189A2007-01-18
JPH11335564A1999-12-07
JP2000265067A2000-09-26
JP2008156545A2008-07-10
JP2010215719A2010-09-30
JP2002020718A2002-01-23
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa



 
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