Title:
ADHERING AND PEELING METHOD OF PROTECTION TAPE
Document Type and Number:
Japanese Patent JP3880397
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an adhering and peeling method of protection tape for adhering a plurality of sheets of protection tape in a multilayer form to the surface of a semiconductor wafer and surely peeling the protection tape adhered in the multilayer form.
SOLUTION: The protection tape T1 adhered with a tape adhering mechanism to the surface of a wafer W suctioned and held with a chuck table is cut with a cutter unit in the wafer shape. Next, a protection tape T3 which is more adhesive than the first sheet or the protection take T1 is adhered on the protection tape T1. The protection tapes T1, T3 of the multilayer form can be integrally peeled from the surface of the wafer W with a single peeling operation of a tape peeling apparatus 15.
Inventors:
Masayuki Yamamoto
Application Number:
JP2001396919A
Publication Date:
February 14, 2007
Filing Date:
December 27, 2001
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
H01L21/304; H01L21/00; H01L21/683; (IPC1-7): H01L21/304; H01L21/68
Domestic Patent References:
| JP64069013A | ||||
| JP62271451A | ||||
| JP6232257A | ||||
| JP8001220U | ||||
| JP2028950A | ||||
| JP2001210610A | ||||
| JP1163332U |
Attorney, Agent or Firm:
Tsutomu Sugiya