Title:
粘着剤の塗布方法及び接合品
Document Type and Number:
Japanese Patent JP6657112
Kind Code:
B2
Abstract:
In the present invention, an adhesive is molded in elongated fashion, and an adhesion-preventive treatment is then performed on the surface of the adhesive. The adhesive subjected to the adhesion-preventive treatment is wound and stored until the time of use thereof. The stored adhesive is supplied to a heating member 21 having a discharge hole 21b, heated in the vicinity of the discharge hole 21b and softened or melted, and is discharged from the discharge hole 21b and applied to a joining surface.
Inventors:
Hiroshi Makihara
Kosaku Yamada
Kosaku Yamada
Application Number:
JP2016559377A
Publication Date:
March 04, 2020
Filing Date:
April 19, 2016
Export Citation:
Assignee:
Hayakawa Rubber Co., Ltd.
International Classes:
B05D7/24; B05D3/00; C09J5/02
Domestic Patent References:
| JP9500817A | ||||
| JP63039977A | ||||
| JP2000033322A | ||||
| JP2005036067A | ||||
| JP2001170545A | ||||
| JP2086871A |
Attorney, Agent or Firm:
Maeda patent office