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Title:
ADHESIVE APPLICATOR
Document Type and Number:
Japanese Patent JPH03188966
Kind Code:
A
Abstract:

PURPOSE: To quantitatively apply an adhesive with high precision of coating amt. resolving power by forming a part of the passage extending from an adhesive tank to an orifice or providing a piezo element for vibrating a part constituting the passage and a pulse power source connected to the element.

CONSTITUTION: A pulse voltage is impressed on the piezo element 4, hence the element 4 is minutely vibrated, and an adhesive 9 is excited by the minute pressure. The pressure wave is transmitted toward an adhesive tank 14 and an orifice 2, and the surface of the adhesive 9 is bulged when the pressure wave reaches the orifice 2 which is a free end. At this time, when a sufficiently high pulse voltage is impressed with respect to the viscosity of the adhesive 9, the discharging power exceeds the power to pull the adhesive inward, and the adhesive 9 is flown as droplets 19 to the surface to be coated, and the surface is coated. Since the adhesive 9 is micronized in this way, the adhesive is quantitatively applied with high precision of coating amt. resolving power irrespective of the state of the tip surface of the applicator and surface to be coated.


Inventors:
ISHIMARU ICHIRO
TAKAHASHI NAOKI
MIYAGAWA TADAO
Application Number:
JP32844389A
Publication Date:
August 16, 1991
Filing Date:
December 20, 1989
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
B05C5/00; B05C5/04; (IPC1-7): B05C5/00; B05C5/04
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)



 
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