To provide an electric and electronic adhesive composite having an electric connection with a low resistivity to COG mountings and COF mountings and no short circuit, a method for connecting a circuit terminal and a connection structure of the circuit terminal.
The adhesive is inserted between circuit electrodes opposing to one another to apply pressure to the circuit electrodes and electrically connect electrodes in the pressurizing direction. The adhesive composite consists of (1) an epoxy resin, (2) a latent curing agent, (3) a film forming material and (4) conduction particles as essential components, and has a fluidity expressed as (B)/(A) is 1.3-2.0, where (A) represents an area before heating pressurization and (B) an area after heating pressurization. In the method for connecting circuit terminals, a first circuit member having a first connection terminal and a second circuit member having a second connection terminal are arranged so that the first connecting terminal is opposing to the second circuit terminal, said adhesive composite is inserted between the first connection terminal and the second connection terminal opposing to one another, and the first connection terminal and the second connection terminal are electrically connected by heat and pressure.
WATANABE ITSUO
GOTO YASUSHI
HIROZAWA YUKIHISA
FUJII MASANORI
| JPH1150032A | 1999-02-23 | |||
| JP2002201456A | 2002-07-19 | |||
| JP2001064619A | 2001-03-13 | |||
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| JPH11241050A | 1999-09-07 | |||
| JPH08181164A | 1996-07-12 | |||
| JP2000183257A | 2000-06-30 |
| WO1998044067A1 | 1998-10-08 |
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