Title:
回路接続用接着剤組成物、回路接続用フィルム状接着剤及び回路部材の接続構造
Document Type and Number:
Japanese Patent JP5012903
Kind Code:
B2
Abstract:
The adhesive composition of the invention contains (a) organic fine particles comprising at least one selected from the group consisting of alkyl (meth)acrylate ester-butadiene-styrene copolymer or complexes thereof, alkyl (meth)acrylate ester-silicone copolymer or complexes thereof and silicone-(meth)acrylic acid copolymer or complexes thereof.
Inventors:
Hiroyuki Izawa
Toshiaki Shirasaka
Katogi Shigeki
Naoto Kudo
Keiko Tomizawa
Toshiaki Shirasaka
Katogi Shigeki
Naoto Kudo
Keiko Tomizawa
Application Number:
JP2009526395A
Publication Date:
August 29, 2012
Filing Date:
July 29, 2008
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J4/00; C09J7/00; C09J9/02; C09J11/08; C09J125/10; C09J133/00; C09J163/00; C09J183/00; H01B1/22; H05K1/14; H05K3/32
Domestic Patent References:
| JP2008195852A | 2008-08-28 | |||
| JP2002285135A | 2002-10-03 | |||
| JPH09237517A | 1997-09-09 | |||
| JP2003168323A | 2003-06-13 | |||
| JP2003049151A | 2003-02-21 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Yoshinori Shimizu