Title:
接着剤組成物及び接続構造体
Document Type and Number:
Japanese Patent JP7264598
Kind Code:
B2
Abstract:
[Problem] To provide an adhesive composition with high adhesion reliability, a connection structure, and a manufacturing method of the connection structure. [Solution] This adhesive composition contains a film forming resin, an acrylate-base compound, a polymerization initiator, and a carbodiimide-base compound, wherein at least one of the film forming resin and acrylate-base compound is a compound having a carboxy group, and the content of the carbodiimide-base compound is 0.1-150 mass% of the total mass of the compounds having a carboxy group.
Inventors:
Noriyuki Watanabe
Application Number:
JP2018070659A
Publication Date:
April 25, 2023
Filing Date:
April 02, 2018
Export Citation:
Assignee:
Dexerials Co., Ltd.
International Classes:
C09J175/04; C09J4/02; C09J9/02; C09J11/04; C09J11/06; C09J167/00; H01L21/60
Domestic Patent References:
| JP2012097162A | ||||
| JP2016035046A | ||||
| JP2014201701A | ||||
| JP2001003031A | ||||
| JP2001019821A | ||||
| JP2012140589A |
Foreign References:
| KR1020120077053A | ||||
| WO2014010524A1 |
Attorney, Agent or Firm:
Nobuhiro Noguchi
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