Title:
ADHESIVE COMPOSITION HAVING ANISOTROPIC CONDUCTIVITY AND ADHESIVE FILM HAVING ANISOTROPIC CONDUCTIVITY FORMED FROM THE SAME
Document Type and Number:
Japanese Patent JP2001279215
Kind Code:
A
Abstract:
To obtain an adhesive composition having anisotropic conductivity, capable of rapidly hardening at a low temperature in heat pressing, having sufficient pot life, and exhibiting an excellent mutual connecting stability after mutual connection of substrates.
This adhesive composition having anisotropic conductivity includes an epoxy resin including an alicyclic epoxy resin and an epoxy resin including glycidyl group, an ultraviolet-activating cationic polymerization catalyst, a cationic polymerization inhibitor and conductive particles.
Inventors:
YAMAGUCHI HIROAKI
HIROSHIGE YUJI
HATA MICHIRU
KITAMURA SATORU
HIROSHIGE YUJI
HATA MICHIRU
KITAMURA SATORU
Application Number:
JP2000088552A
Publication Date:
October 10, 2001
Filing Date:
March 24, 2000
Export Citation:
Assignee:
THREE M INNOVATIVE PROPERTIES
International Classes:
C08G59/22; C08G59/24; C09J7/10; C09J153/02; C09J163/00; H01B1/22; H01B1/24; H01B5/16; H05K3/32; (IPC1-7): C09J163/00; C09J7/02; C09J153/02; H01B1/22; H01B5/16
Attorney, Agent or Firm:
Takashi Ishida (4 others)