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Title:
ADHESIVE COMPOSITION FOR SURFACE PROTECTIVE FILM, AND SURFACE PROTECTIVE FILM USING THIS
Document Type and Number:
Japanese Patent JP2011236266
Kind Code:
A
Abstract:

To provide an adhesive composition for a surface protective film in which there is less generation of static electricity by peeling electrification, and which is excellent in adhesion, peelability, water resistance, and durability, and a surface protective film using the same.

The adhesive composition for a surface protective film includes: an acrylic copolymer (A) which comprises carrying out copolymerization of 2-ethylhexyl acrylate and 4-hydroxybutyl acrylate at least; a urethodione ring containing bifunctional isocyanate compound (B); a hexamethylenediisocyanate based isocyanate compound (C) other than the isocyanate compound (B); a dimethyl silicone compound (D) which has a polyoxyalkylene group; and an alkali metal salt (E).


Inventors:
NAKANO HIROTO
ONO YOSHIHITO
KANO HAJIME
Application Number:
JP2010106369A
Publication Date:
November 24, 2011
Filing Date:
May 06, 2010
Export Citation:
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Assignee:
NIPPON CARBIDE KOGYO KK
International Classes:
C09J133/04; B32B27/00; B32B27/30; C09J7/02; C09J11/04; C09J175/04; C09J183/04
Domestic Patent References:
JP2003041229A2003-02-13
JP2009275128A2009-11-26
JPH06172735A1994-06-21
JP2002226538A2002-08-14
JPH0532759A1993-02-09



 
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