Title:
ADHESIVE COMPOSITION FOR WOOD
Document Type and Number:
Japanese Patent JP3645705
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a coniferous plywood satisfying F1 standard in the formaldehyde diffusion amount standard of JAS concerning a plywood, a woody board satisfying E0 standard in the formaldehyde diffusion amount standard of JIS concerning a woody board and a rapidly curable adhesive.
SOLUTION: This adhesive composition for wood has 0.40-0.60 equivalent ratio of formaldehyde to the amino group of melamine and or urea to be reacted in a melamine/formaldehyde resin, a urea/formaldehyde resin or a melamine/urea/formaldehyde resin obtained by reacting melamine with urea or formaldehyde, and is obtained by adding hexamethylenetetramine to the reaction mixture after the reaction.
Inventors:
Takuhiro Sugiyama
Yozo Shioda
Yozo Shioda
Application Number:
JP4658498A
Publication Date:
May 11, 2005
Filing Date:
February 27, 1998
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C09J11/06; C09J161/20; (IPC1-7): C09J161/20; C09J11/06
Domestic Patent References:
| JP7126596A | ||||
| JP2001717A | ||||
| JP48079241A | ||||
| JP3203979A | ||||
| JP62004768A | ||||
| JP48058109A | ||||
| JP5287253A | ||||
| JP10237403A | ||||
| JP10110151A | ||||
| JP48072309A | ||||
| JP48051032A | ||||
| JP1230686A |