Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JPH09249869
Kind Code:
A
Abstract:
To obtain an adhesive composition suitable for forming an adhesive layer at a fine part e.g. a tip end part of a lead frame finger in mask printing method.
This adhesive composition contains an adhesive resin and an inorganic filler, and is a paste state adhesive composition capable of being applied to a prescribed place of a lead frame with a mask printing. In this adhesive composition, a ratio of a solid fraction (a) based on a solvent 1, is 1.2≤a≤2.9 and viscosity ranges (b) are in the ranges of 1000≤b≤1500Pa.S at 0.1rpm shearing speed, 400≤b≤550Pa.S at 0.5rpm and 300≤b≤400Pa.S at 1.0rpm measured at 25°C.
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Inventors:
SEGAWA SATOSHI
SHIMADA YOICHI
SHIMADA YOICHI
Application Number:
JP6326896A
Publication Date:
September 22, 1997
Filing Date:
March 19, 1996
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C09J11/04; C08G73/10; C09J11/06; C09J179/08; C09J201/00; H01L21/52; (IPC1-7): C09J179/08; C08G73/10; C09J11/04; C09J201/00; H01L21/52
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