Title:
接着剤組成物、接着フィルム及び半導体装置
Document Type and Number:
Japanese Patent JP5293496
Kind Code:
B2
Abstract:
To provide an adhesive composition for bonding an electronic part such as a semiconductor element to a lead frame or an insulation supporting substrate and durable to the thermal history of the high-temperature soldering upon mounting and provide an adhesive film and a semiconductor device.
The adhesive composition comprises a resin and a filler. The filler has a spherical form having an average particle diameter of 10 μm or less and a maximum particle diameter of 25 μm or less.
COPYRIGHT: (C)2010,JPO&INPIT
Inventors:
Takashi Masuko
Yuji Hasegawa
Aichi Katsue
Yuji Hasegawa
Aichi Katsue
Application Number:
JP2009188711A
Publication Date:
September 18, 2013
Filing Date:
August 17, 2009
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J179/08; C09J7/00; C09J9/02; C09J11/04; C09J163/00; C09J183/10; H01L21/52
Domestic Patent References:
| JP5036307A | ||||
| JP11092744A | ||||
| JP11066953A | ||||
| JP2000129218A | ||||
| JP11323261A | ||||
| JP10182967A | ||||
| JP10245539A | ||||
| JP2286706A | ||||
| JP63260924A |
Foreign References:
| US5204399 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu