Title:
接着剤組成物、回路接続構造体及び半導体装置
Document Type and Number:
Japanese Patent JP5201181
Kind Code:
B2
Abstract:
Disclosed are an adhesive composition containing a resin having piperazine skeletons, a circuit connecting structure, a semiconductor device, and an adhesion improvement agent for glass.
Inventors:
Naoto Kudo
Yasuhiro Arifu
Koji Kobayashi
Kume Masahide
Katsuyuki Masuda
Takako Ejiri
Yasuhiro Arifu
Koji Kobayashi
Kume Masahide
Katsuyuki Masuda
Takako Ejiri
Application Number:
JP2010179753A
Publication Date:
June 05, 2013
Filing Date:
August 10, 2010
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J7/00; C09J9/02; C09J11/02; C09J133/14; C09J175/04; C09J177/00; C09J179/04; C09J179/08; C09J201/00; C09J201/02; H01L21/60; H05K1/14; H05K3/36
Domestic Patent References:
| JP60260671A | ||||
| JP56163141A | ||||
| JP2252718A | ||||
| JP59126483A | ||||
| JP2006057026A | ||||
| JP2000328019A | ||||
| JP1113480A | ||||
| JP2002203427A |
Foreign References:
| WO2008023670A1 | ||||
| WO1998044067A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano