Title:
接着フィルム、ダイシングテープ一体型接着フィルム、複層フィルム、半導体装置の製造方法および半導体装置
Document Type and Number:
Japanese Patent JP6603479
Kind Code:
B2
Abstract:
The objective of the present invention is to provide an adhesive film capable of reducing voids around a bonding wire, and resistant to being emptied out. The present invention also aims at providing a dicing tape-integrated adhesive film, a multilayer film and the like, all of which comprise such an adhesive film. The present invention relates to an adhesive film and the like, having a tan of 0.7-2.0 (loss modulus G/storage modulus G) at 0.1 Hz and 120C.
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Inventors:
Yuichiro Shishido
Sadahito Misumi
Takamoto Naohide
Kenji Onishi
Sadahito Misumi
Takamoto Naohide
Kenji Onishi
Application Number:
JP2015100954A
Publication Date:
November 06, 2019
Filing Date:
May 18, 2015
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C09J7/30; B32B27/00; C09J11/04; C09J11/08; C09J133/00; C09J161/04; C09J163/00; H01L21/301; H01L21/52; H01L25/065; H01L25/07; H01L25/18
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Foreign References:
| US20070254136 | ||||
| US20110210455 |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office