Title:
ADHESIVE FILM-INTEGRATED SURFACE PROTECTION TAPE FOR USE IN GRINDING THIN FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP
Document Type and Number:
Japanese Patent JP2015218287
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an accurate and simple method for manufacturing a semiconductor chip without use of an underfill, in manufacturing a semiconductor chip by grinding the rear face of a semiconductor wafer having a bump electrode for use in mounting a flip chip, and chipping the wafer at the same time or in the subsequent step; and an adhesive film-integrated surface protection tape for use in grinding a thin film.SOLUTION: An adhesive film-integrated surface protection tape for use in grinding a thin film includes: an adhesive tape for processing semiconductors composed of an adhesive disposed on a substrate; and a glue film for use in connecting a flip chip, disposed on the adhesive tape. The glue film includes an epoxy resin selected from the group consisting of a bisphenol type, a naphthalene type, a phenol novolak type, a cresol novolak type, a phenol aralkyl type, a biphenyl type, a triphenylmethane type, and a dicyclopentadiene type. The adhesive film-integrated surface protection tape for use in grinding a thin film includes a hardening agent in an amount of 0.001 to 3.0 parts by mass, a polymer compound having a polymerization average molecular weight of 10,000 or more in an amount of 0 to 50 parts by mass, and an inorganic filler in an amount of 0 to 60 parts by mass, relative to 100 parts by mass of the epoxy resin. A method for manufacturing a semiconductor chip is also provided.
Inventors:
UCHIYAMA TOMORO
YOKOI HIROTOKI
YOKOI HIROTOKI
Application Number:
JP2014103832A
Publication Date:
December 07, 2015
Filing Date:
May 19, 2014
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
C09J7/02; C09J11/04; C09J11/06; C09J133/00; C09J163/00; C09J171/12; C09J179/08; H01L21/301; H01L21/304; H01L21/60
Domestic Patent References:
| JP2008133423A | 2008-06-12 | |||
| JP2014013807A | 2014-01-23 | |||
| JP2010251727A | 2010-11-04 |
Attorney, Agent or Firm:
Toshizo Iida
Naosuke Miyamae
Naosuke Miyamae
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