Title:
ADHESIVE FILM FOR SEMICONDUCTOR WAFER DICING
Document Type and Number:
Japanese Patent JPS58147044
Kind Code:
A
Abstract:
PURPOSE:To ensure adequate adhesive force of a dicing film and to prevent contamination of semiconductor by a film by giving a structure to a bonding layer of said dicing film in the manner that a plasticizer is added to a copolymer using a polyvinylchloride as the structural unit. CONSTITUTION:A vinylchloride is used as a structural unit and moreover a monomer such as an acrylic glycidylester, acrylic acid, ethylene and vinyl acetate etc. is used as a structural unit of a second element. A methacrylic acid glycidyl is particularly suited among an acrylic acid, methacrylic acid having the glycidyl group or the ester of its derivative and content is about 1-10wt% as in the case of other monomer. If it is insufficient in amount, flexibility and adhesiveness also become insufficient, while if it is excessive, heat resistivity becomes insufficient. Moreover, a plasticizer for ordinary polyvinylchloride such as a dioctyl phthalate is added within the range of 10-40wt% for the copolymer in the 100wt%. A wafer 2 is placed on the film having a bonding layer 1 formed in the thickness of 50-400mu and is slightly pressed. This adhesive film has a sufficient adhesive force to the wafer and there is no fear of contaminating wafer with a plasticizer at the time of dicing.
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Inventors:
OTANI ISAO
Application Number:
JP2918582A
Publication Date:
September 01, 1983
Filing Date:
February 24, 1982
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
H01L21/301; H01L21/78; (IPC1-7): H01L21/78
Domestic Patent References:
| JPS5351896U |
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