Title:
ADHESIVE FILM
Document Type and Number:
Japanese Patent JP2007231217
Kind Code:
A
Abstract:
To provide an adhesive film replaceable with a die attach paste.
The invention relates to the adhesive film which is used for protection of semiconductor elements in a quad flat non-lead package, having double layered structure comprising a heat resistant resin layer with a glass transition temperature higher than 300°C and a thermosetting resin layer with a glass transition temperature lower than 100°C.
COPYRIGHT: (C)2007,JPO&INPIT
Inventors:
KODAMA YOICHI
Application Number:
JP2006057438A
Publication Date:
September 13, 2007
Filing Date:
March 03, 2006
Export Citation:
Assignee:
MITSUI CHEMICALS INC
International Classes:
C09J7/02; C09J179/08; H01L23/12