Title:
ADHESIVE FILM
Document Type and Number:
Japanese Patent JP2007284671
Kind Code:
A
Abstract:
To provide an adhesive film having fillability to irregularities of insulation substrates after heating in a large number of die bond processes, wire bond processes and the like in a stacked package, and resistant to soldering heat treatments at about 250°C in mounting the film together with high adhesiveness in a heated state.
The adhesive film comprises a polyimide resin, an epoxy resin and a curing agent. In the film, 0-50 pts.wt. curing agent is added to 100 pts.wt. epoxy resin.
COPYRIGHT: (C)2008,JPO&INPIT
Inventors:
KIMURA KOICHI
Application Number:
JP2007076036A
Publication Date:
November 01, 2007
Filing Date:
March 23, 2007
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J7/02; C09J161/06; C09J163/00; C09J179/08
Domestic Patent References:
| JPH11209729A | 1999-08-03 | |||
| JPH11209728A | 1999-08-03 | |||
| JPH11236536A | 1999-08-31 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu