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Title:
ADHESIVE FILM
Document Type and Number:
Japanese Patent JP2013040339
Kind Code:
A
Abstract:

To provide an adhesive film having adhesiveness at low temperature and formable of a pattern by an alkali developing solution.

The adhesive film 1 contains a resin having an imide backbone in a main chain, obtained by reacting tetracarboxylic dianhydride with a diamine, a radiation polymerizable compound and a photoinitiator, wherein the diamine contains a specific aliphatic ether diamine in 10-90 mol% of the whole diamine. An adhesive pattern is formed by bonding the adhesive film 1 on an adherend, exposing the adhesive film 1, and then developing with a 2.38% solution of tetramethylammonium hydride, and another adherend can be bonded to the adherend through the adhesive pattern.


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Inventors:
KAWAMORI TAKASHI
MASUKO TAKASHI
KATOGI SHIGEKI
YASUDA MASAAKI
Application Number:
JP2012211171A
Publication Date:
February 28, 2013
Filing Date:
September 25, 2012
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J7/02; C08G73/10; C09J4/00; C09J11/06; C09J179/08; H01L23/02
Domestic Patent References:
JPWO2007004569A12009-01-29
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Junichiro Sakamaki
Hideki Okita



 
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