Title:
絆創膏用包装材および絆創膏包装体
Document Type and Number:
Japanese Patent JP5524180
Kind Code:
B2
Abstract:
Disclosed herein is a package material for adhesive bandage which is used for packaging therein an adhesive bandage including a surface base having one surface, an adhesive layer provided on the one surface of the surface base and a releasing sheet attached to the adhesive layer so as to cover it. The package material comprises a first sheet having a first sheet base and a first cold seal layer provided on the first sheet base, and a second sheet having a second sheet base and a second cold seal layer provided on the second sheet base. The first cold seal layer faces the surface base of the adhesive bandage and the second cold seal layer faces the releasing sheet of the adhesive bandage when the adhesive bandage is packaged in the package material. Further, each of the first cold seal layer and the second cold seal layer is formed of a mixture of rubber and acrylic resin, and an amount of the rubber contained in the first cold seal layer is smaller than an amount of the rubber contained in the second cold seal layer.
Inventors:
Tomio Hatanaka
Tomomi Sumitani
Tomomi Sumitani
Application Number:
JP2011505990A
Publication Date:
June 18, 2014
Filing Date:
March 16, 2010
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
B65D75/30; A61F13/02
Domestic Patent References:
| JP2002502777A | 2002-01-29 | |||
| JP2002530150A | 2002-09-17 | |||
| JP2009022750A | 2009-02-05 | |||
| JP2003024369A | 2003-01-28 | |||
| JP2009522178A | 2009-06-11 |
Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi
Kazuo Asahi