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Title:
ADHESIVE PRODUCT HAVING SUBSTRATE MATERIAL FOR PEELING OFF
Document Type and Number:
Japanese Patent JP2007269910
Kind Code:
A
Abstract:

To provide a suitable constitution of an adhesive product with a peeling off agent layer, having an adhesive layer of a polyoxypropylene-based polymer-based adhesive composition having an alkenyl group.

This adhesive product having a substrate material for peeling off, with the peeling off agent layer and the substrate material for peeling off, with the adhesive layer is provided with that the peeling off agent layer is a cured material obtained by irradiating a composition (C) consisting of (A) a silicone resin containing a cationically polymerizable epoxy group, and (B) a cationic polymerization initiator, with ultraviolet light, and the adhesive layer is a cured material of (G) an adhesive composition containing (D) a polyoxyalkylene polymer having an alkenyl group, (E) a compound having hydrosilyl group and (F) a hydrosilylation catalyst as essential components.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
UEDA KAZUHIKO
Application Number:
JP2006095340A
Publication Date:
October 18, 2007
Filing Date:
March 30, 2006
Export Citation:
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Assignee:
KANEKA CORP
International Classes:
C09J7/02; C09J11/00; C09J171/02
Domestic Patent References:
JP2002241504A2002-08-28
Foreign References:
WO2005033239A12005-04-14