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Title:
ADHESIVE RESIN COMPOSITION AND MULTILAYER ARTICLE
Document Type and Number:
Japanese Patent JP2007092027
Kind Code:
A
Abstract:

To provide an adhesive resin composition which is excellent in adhesion, heat resistance, film formability and film quality, and to provide a multilayer article having an adhesive resin layer comprised of the adhesive resin composition.

The adhesive resin composition comprises 10-99.5% by weight of a resin component (A), 0.5-30% by weight of another resin component (unsaturated carboxylic acid-modified polypropylene), and 0-89.5% by weight of a still another resin component (olefin resin). The resin component (A) is a propylene-based product obtained by step polymerization, which contains 10-60% by weight of a propylene homopolymer component (a1) and 40-90% by weight of a propylene-ethylene copolymer component (a2). With respect to the resin component (A), the (a1)-derived content soluble in xylene at room temperature is 1-20% by weight, the (a2)-derived component insoluble in xylene at room temperature is less than 20% by weight, the (a2)-derived component soluble in xylene at room temperature is 10-60% by weight, and the content of α-olefins other than propylene in the (a2)-derived component soluble in xylene at room temperature is ≥20% by weight.


Inventors:
IKEDA MUTSUKO
Application Number:
JP2006161184A
Publication Date:
April 12, 2007
Filing Date:
June 09, 2006
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP
International Classes:
C08L23/10; C08L33/02
Domestic Patent References:
JPH0436338A1992-02-06
JP2004025460A2004-01-29
JP2000198860A2000-07-18
JP2000186174A2000-07-04
Attorney, Agent or Firm:
Tsuyoshi Shigeno