Title:
ADHESIVE FOR RESIN AND RESIN LAMINATE
Document Type and Number:
Japanese Patent JP3965964
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain an adhesive for a resin which is suitable for producing a resin adhesive body, especially a resin laminated sheet, which hardly causes a foaming a the adhesive layer or the interface of the adhesive layer and an adherend even when it is exposed under a condition of high temperature.
SOLUTION: The adhesive contains (A) a monofunctional unsaturated monomer mainly consisting of methyl methacrylate in an amount of 50-99 pts.wt., (B) a polymer of an unsaturated monomer mainly consisting of methyl methacrylate in an amount of 1-50 pts.wt., (C) a polyfunctional unsaturated monomer having at least two radically polymerizable double bonds in the molecule in an amount of 0.01-2 pts.wt. based on the components (A) and (B) of the total 100 pts.wt. and (D) an organic peroxide having a half life temperature for 10 hours of 40-60°C in an amount of 0.01-1 pts.wt. based on the components (A) and (B) of the total 100 pts.wt.
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Inventors:
Tomohiro Mizumoto
Masashi Mori
Masashi Mori
Application Number:
JP2001332091A
Publication Date:
August 29, 2007
Filing Date:
October 30, 2001
Export Citation:
Assignee:
Sumitomo Chemical Co., Ltd.
International Classes:
C09J4/02; C09J11/06; (IPC1-7): C09J4/02; C09J11/06
Domestic Patent References:
| JP7070518A |
Attorney, Agent or Firm:
Takashi Kuboyama
Toru Nakayama
Masayuki Enomoto
Toru Nakayama
Masayuki Enomoto