Title:
粘着シートの製造方法、ダイシング・ダイボンディング一体型テープの製造方法、半導体装置の製造方法、粘着剤の処理方法、被着体の固定化方法、及び被着体の剥離方法
Document Type and Number:
Japanese Patent JP7283472
Kind Code:
B2
Abstract:
The present invention discloses a method for manufacturing an adhesive sheet, said method including: a step for preparing an adhesive sheet precursor having a substrate and an adhesive layer provided on the substrate; and a step for performing plasma treatment on a surface of the adhesive layer on the side opposite to the substrate in the adhesive sheet precursor.
Inventors:
Michiko Kaya
Daisuke Yamanaka
Daisuke Yamanaka
Application Number:
JP2020523168A
Publication Date:
May 30, 2023
Filing Date:
June 06, 2019
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
C09J7/38; C09J5/00; C09J5/02; C09J201/00; H01L21/301; H01L21/52
Domestic Patent References:
| JP2000073029A | ||||
| JP2009086452A | ||||
| JP2009148996A | ||||
| JP57015627B2 | ||||
| JP57015627A | ||||
| JP2012084784A | ||||
| JP2005148638A | ||||
| JP2013117004A | ||||
| JP9100448A | ||||
| JP10125768A | ||||
| JP7294585A | ||||
| JP2017125105A |
Foreign References:
| WO2013035792A1 | ||||
| WO2009093577A1 | ||||
| WO2009113616A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano
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