To provide an adhesive sheet for semiconductor that has a stress relaxing property and a substrate unevenness burying property needed when mounting a semiconductor element on a substrate for semiconductor mounting and is superior in heat resistance and moisture resistance, and to provide an adhesive sheet for a dicing integrated semiconductor using the same.
The adhesive sheet for the semiconductor includes a high molecular weight component, and one or both of an aliphatic epoxy resin and a cycloaliphatic epoxy resin. It is preferred that the high molecular weight component has a Tg of -10 to 60°C and a weight average molecular weight of 20,000 to 1,000,000, and a resin component contains 80 to 95% by mass of the high molecular weight component and 2 to 20% by weight of the aliphatic epoxy resin or cycloaliphatic epoxy resin.
KO MASAHIKO
SAWABE KOICHI
HATAKEYAMA KEIICHI
TOKUYASU TAKAHIRO
