Title:
粘着シート
Document Type and Number:
Japanese Patent JP7283654
Kind Code:
B2
Abstract:
To provide an adhesive sheet, the sheet increasing manufacturing efficiency of products including an adhesive agent layer, while using the adhesive agent layer to which an electro-conductive organic polymer compound is added. An adhesive sheet for use in applying a wiring board to a surface onto which the wiring board is to be applied, the adhesive sheet is constituted by an adhesive agent layer including an electro-conductive organic polymer compound and an adhesive material; a first releasing sheet provided on front surface of the adhesive agent layer; and a second releasing sheet provided on a back surface corresponding to a back surface of the front surface in the adhesive agent layer.
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Inventors:
Masayuki Iwase
Teppei Araki
Takeshi Sekiya
Shusuke Yoshimoto
Teppei Araki
Takeshi Sekiya
Shusuke Yoshimoto
Application Number:
JP2019045152A
Publication Date:
May 30, 2023
Filing Date:
March 12, 2019
Export Citation:
Assignee:
Nippon Mektron Co., Ltd.
National University Corporation Osaka University
National University Corporation Osaka University
International Classes:
C09J7/38; A61K50/00; C09J7/10; C09J9/02; C09J11/08; C09J133/00; C09J201/00
Domestic Patent References:
| JP2016089021A | ||||
| JP2012017399A | ||||
| JP2017186486A | ||||
| JP2017057256A | ||||
| JP2001238860A | ||||
| JP2004114559A | ||||
| JP2004224835A | ||||
| JP2001181597A | ||||
| JP201766407A | ||||
| JP200991485A |
Foreign References:
| WO2018101438A1 |
Attorney, Agent or Firm:
Mitsuru Iwaike
Kazuhiro Suganuma
Kazuhiro Suganuma