PURPOSE: To decrease the percent defective in wire bonding by providing the constitution wherein the thickness of a heat resisting adhesion layer has a value within a specified range, at least a heat resisting film or the heat resisting adhesion layer contains colored inorganic filler, organic pigment or dye, and the light reflecting density of adhesive tape has a specified value or more.
CONSTITUTION: The thickness of a heat resisting adhesion layer 72 has a value within the range of 1-150μm. At least, a heat resisting film 71 or the heat resisting adhesion layer contains colored inorganic filler, organic pigment or dye. The light reflecting density of an adhesive tape is made to be 0.6 or more. The heat resisting film 71 comprising polyimide, polyetherimide and the like and the composite heat resisting film 71 comprising epoxy-glass cloth, epoxy resin-polyimide-glass cloth and the like are used. For the heat resisting adhesion layer, NBR-based adhesive agent, polyester-based adhesive agent, polyimide- based adhesive agent and epoxy-based adhesive agent can be used. When the adhesive agent is of a hardening type, the agent is dried to the semi-hardened state in a B stage after the agent is applied on the heat resisting film.
YOKOYAMA SHIGEYUKI
SHIBUYA AKIHIRO
KOSHIMURA ATSUSHI
SHIMIZU MITSUHARU
FUJII HIROFUMI
SHINKO ELECTRIC IND CO