Title:
ADHESIVE TAPE
Document Type and Number:
Japanese Patent JP2013173942
Kind Code:
A
Abstract:
To provide an adhesive tape having excellent thermal conductivity.
An adhesive tape includes a base material layer formed of a plastic material or the like, and an adhesive layer formed at least on one-side surface of the base material layer. In the adhesive tape, the value of thermal resistance at 80°C is <2.00 [cm2*K/W], and the total thickness of the base material layer and the adhesive layer is <10 μm. The adhesive layer may be formed on both the surfaces of the base material layer. The total thickness of the base material layer and the adhesive layer may be <6 μm.
Inventors:
SOEDA YOSHIKAZU
SADASHI KENTA
YOSHIDA SHO
MIZUTORI TAKAHISA
SUZUKI SHUNEI
SADASHI KENTA
YOSHIDA SHO
MIZUTORI TAKAHISA
SUZUKI SHUNEI
Application Number:
JP2013084068A
Publication Date:
September 05, 2013
Filing Date:
April 12, 2013
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
C09J7/02; B32B27/00; C09J201/00
Domestic Patent References:
| JP2012052099A | 2012-03-15 | |||
| JP2005105212A | 2005-04-21 | |||
| JP2011026361A | 2011-02-10 | |||
| JP2006332308A | 2006-12-07 |
Attorney, Agent or Firm:
Sakaki Morishita