Title:
ADHESIVE FOR WIRING BOARD
Document Type and Number:
Japanese Patent JPH01197549
Kind Code:
A
Abstract:
PURPOSE:To obtain the title adhesive suppressed in delay of propagation and improved in a wiring density, by dissolving a mixture of an organic solvent- soluble fluorocarbon resin with a filler in an organic solvent. CONSTITUTION:A mixture of a fluorocarbon resin (A) having a low specific dielectric constant and being soluble in an organic solvent with a filler (B) and a curing agent (C) for component A is dissolved in an organic solvent (D) to obtain the title adhesive having a melt viscosity (100 deg.C) of 10<4>-10<7>P in a tack-free state. This adhesive is useful as an adhesive for a wiring board in which the necessary wiring pattern is made of an insulated wire.
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Inventors:
IWASAKI YORIO
OKAMURA TOSHIRO
ARIGA SHIGEHARU
KOJIMA FUJIO
AMANO SABURO
KAMIYAMA KOJI
OKAMURA TOSHIRO
ARIGA SHIGEHARU
KOJIMA FUJIO
AMANO SABURO
KAMIYAMA KOJI
Application Number:
JP2236888A
Publication Date:
August 09, 1989
Filing Date:
February 02, 1988
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L27/12; C09J127/12; H05K3/38; (IPC1-7): C08L27/12; C09J3/00; H05K3/38
Attorney, Agent or Firm:
Hirose Akira
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