Title:
接着体、接着体の組立て方法、および接着体の解体方法
Document Type and Number:
Japanese Patent JP6962500
Kind Code:
B2
Abstract:
The objective of the present invention is to provide a bonded body wherein, even when an adhesive tape is removed at an angle relative to a adhered surface, the load on the adhesive tape can be reduced to prevent tearing. This bonded body comprises an adhesive tape, a first adherend adhered on one surface of the adhesive tape, and a second adherend adhered on the other surface of the adhesive tape, and is characterized in that: the first adherend includes, on a first adhered surface of the first adherend having the adhesive tape adhered thereon, in a section adjacent to a corner demarcating the first adhered surface, a release portion having a contact angle of 80 to 180° and a thickness of 10 μm or less; the adhesive tape is adhered over the release portion, while on the adhesive tape, a section that is more toward an edge part than the section that is adhered on the release portion is positioned outward from the first adhered surface; and the adhesive tape comprises a base material layer with an elongation at break of 200 to 3,000% and a breaking strength of 1.5 to 80 MPa, and an adhesive layer on each of the surfaces of the base material layer.
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Inventors:
Akira Yamagami
Daisuke Watanabe
Daisuke Watanabe
Application Number:
JP2021509026A
Publication Date:
November 05, 2021
Filing Date:
March 12, 2020
Export Citation:
Assignee:
DIC Corporation
International Classes:
B32B27/00; B32B7/022; B32B7/06; C09J7/38; C09J201/00
Domestic Patent References:
| JP2017115108A | ||||
| JP2017518404A | ||||
| JP10095957A |
Foreign References:
| US20140123459 | ||||
| CN107722855A |
Attorney, Agent or Firm:
Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno
Akihiro Iwamoto
Takayuki Ohno