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Patent Searching and Data


Title:
Advanced multi- ply panel
Document Type and Number:
Japanese Patent JP6138234
Kind Code:
B2
Abstract:
The multi-ply panel for forming or adding to a wall, floor, or ceiling, or for the inclined surface of a building includes a stack of layers. At least one layer is formed of parallel structural strips, preferably made of wood. Filler strips are placed between the structural strips and made of a different material than that of the structural strips. The materials may be selected for the heat or sound insulation properties, thermal inertia, or fire-resistant properties thereof. At least one rigid filler strip is made of an insulating material with heat conductivity less than 0.038 W/m·K.

Inventors:
Bourdon, Lorraine
Fall, pascal
Gowa, Didier
Chablier, christian
Application Number:
JP2015503909A
Publication Date:
May 31, 2017
Filing Date:
April 11, 2012
Export Citation:
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Assignee:
TECHNIWOOD INTERNATIONAL
International Classes:
E04B1/90; B32B21/04; E04B1/94
Domestic Patent References:
JP10061061A
JP2007309609A
JP2007138635A
JP7035610U
JP2010536941A
JP2004324932A
JP2009263218A
JP3173057U
JP2001132133A
JP2004036138A
JP8209853A
JP2011017236A
JP6212718A
JP9053282A
JP2000234402A
JP3137321U
JP2004169332A
Foreign References:
FR2922565A1
Attorney, Agent or Firm:
Keiichi Ota