Title:
HERMETICALLY SEALED PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2022026004
Kind Code:
A
Abstract:
To provide a hermetically sealed package manufactured by inexpensive equipment, high in reliability and hermetically sealed.SOLUTION: A hermetically sealed package includes a base material and a lid material. The base material and the lid material are hermetically bonded, and a hermetic hollow structure is formed therebetween. The base material includes a device arrangement region for arranging a device and a first closed band-like metalized layer provided so as to surround the device arrangement region. The lid material includes a second closed band-like metalized layer provided at a position corresponding to the first metalized layer and having an own upper surface parallel to an upper surface of the first metalized layer. The first and second metalized layers are bonded by a first bonding layer. A plurality of island-shaped spacers are arranged at positions not overlapping with the first metalized layer and each have a predetermined height higher than a total thickness of those of the first and second metalized layers.SELECTED DRAWING: Figure 1
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Inventors:
NISHIMURA NOZOMI
Application Number:
JP2020129261A
Publication Date:
February 10, 2022
Filing Date:
July 30, 2020
Export Citation:
Assignee:
NEC CORP
International Classes:
G01J1/02; H01L23/02
Attorney, Agent or Firm:
Desk
Keiji Kitajima
Keiji Kitajima